MAX2645EVKIT+【PDF 10/12 页】EVAL KIT MAX2645

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3.4GHz to 3.8GHz SiGe

Low-Noise Amplifier/PA Predriver

Table 2. MAX2645 Noise Parameters

FREQUENCY (MHz)

FMIN (dB)

| Γ opt |

Γ opt ANGLE

R N ( ? )

R BIAS = 20 k ? , V CC = +3.3V, T A = +25 ° C

3400

3450

3500

3550

3600

3650

3700

3750

3800

2.098

2.122

2.148

2.173

2.198

2.225

2.251

2.279

2.306

0.237

0.235

0.235

0.234

0.233

0.232

0.231

0.230

0.229

144.1

146.1

148.2

150.3

152.4

154.5

156.5

158.6

160.7

31.1

31.5

32.0

32.5

32.9

33.5

33.9

34.5

35.0

R BIAS = 15 k ? , V CC = +5V, T A = +25 ° C

3400

3450

3500

3550

3600

3650

3700

3750

3800

2.103

2.127

2.152

2.177

2.203

2.229

2.256

2.282

2.310

0.210

0.209

0.208

0.207

0.206

0.206

0.205

0.204

0.204

146.3

148.4

150.5

152.6

154.7

156.8

158.9

161.0

163.1

31.1

31.6

32.1

32.5

33.0

33.5

34.0

34.6

35.1

RF Output

The RFOUT port is an open-collector output that must be

tied to V CC through an inductance for proper biasing.

The MAX2645 EV kit uses a length of transmission line

equivalent to 1.5nH of inductance. A DC-blocking

capacitor is required and can be part of the output

matching network. See Figure 1 for component values

recommended for operation over the 3.4GHz to 3.8GHz

frequency range. See Table 1 for matching to other fre-

quencies. This transmission line is terminated at the

V CC node with a radial stub for high-frequency bypass-

ing. This arrangement provides a high-Q, low-loss bias

network used to optimize performance. The radial stub

can be replaced with an appropriate microwave

capacitor.

Power-Supply, Bias Circuitry, and Logic-

Input Bypassing

Proper power-supply bypassing is essential for high-fre-

quency circuit stability. Bypass V CC with 10μF, 0.1μF,

and 50pF capacitors located as close to the V CC pin as

possible.

To minimize the amount of noise injected into the bias

circuitry and logic inputs, bypass the pins with capaci-

tors located as near to the device pin as possible. For

additional isolation on the logic-control pins, place resis-

tors between the logic-control inputs and the bypass

capacitors. See Figure 1 for recommended component

values; refer to MAX2645 EV kit manual for recommend-

ed board layout.

Layout Considerations

A properly designed PC board is an essential part of any

RF/microwave circuit. Keep RF signal lines as short as

possible to reduce losses, radiation, and inductance.

Use separate, low-inductance vias to the ground plane

for each ground pin. For best performance, solder the

exposed paddle on the bottom of the device package

evenly to the board ground plane.

10

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